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model
specification
brand
DRAM type
capacity
framework
speed
working voltage
operation temperature
product details
K3QF6F60AM-FGCF
LPDDR3
SAMSUNG/三星
24Gb
x64
1866 Mbps
1.8 / 1.2 / 1.2 V
-25 ~ 85 °C
256FBGA
Mass Production
Click view
KMGX6001BA-B514009
221 FBGA
eMMC 5.1
32 GB
24 Gb
多芯片封裝
H9CCNNN4GTMLAR
DRAM LPDDR3
SK HYNIX/海力士
4Gb
x32
1.8V/1.2V/1.2V
FBGA-178
Mass production
Low Power
H9CCNNNCPTALBR-NUD
BGA
H9CCNNNBLTALAR
16Gb
FBGA-253
H9CCNNNBJTALAR-NVD
BGA-178
H9CCNNNBLTALAR-NVDR
SK hynix/海力士
1.8V-1.2V-1.2V
PKG:178
H54G56BYYQX046
LPDDR4
4GB
4266Mbps
1.8V / 1.1V / 1.1V
200Ball
MP
Spec: UFS 2.0
H54GE6AYRHX270
6GB
1.8V / 1.1V / 0.6V
CS
H54G46BYYPX053
2GB
H54G36AYRBX257
1GB
MT53D1024M32D4DT-046 WT
MICRON/美光
32Gb
DDR4-4266
D9WQG
Production
K4F8E304HB-MGCJ
DRAM LPDDR4
8Gb
3733 Mbps
1.8/1.1/1.1V
-25°C~85°C
FBGA-200
EOL
K4F4E3S4HF-MGCJ
3733Mbps
MT53D512M32D2DS-046 AAT:D
512M x32
2133MHz
0.6V
-40C to +105C
200-ball WFBGA
4266MTPS
CL = Programmable
COMPONENT
LPDDR4 16G X32 WFBGA
MT53E768M32D4DT-053 AAT:E
768M x32
1866MHz
200-ball VFBGA
3733MTPS
LPDDR4 24G X32 VFBGA
MT53D1024M32D4DT-046 AIT:D
1G x32
-40C to +95C
End of Life
LPDDR4 32G X32 VFBGA
K4FBE3D4HM-TFCL
-40°C~95°C
K4FBE3D4HM-GFCL
MT53E1G32D4NQ-046 WT:F
FBGA
D9ZGW
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