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型號
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規(guī)格書
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品牌
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容量
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架構(gòu)
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速率
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工作電壓
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工作溫度
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產(chǎn)品詳情
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KLMAG2GESD-C02P |
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KLMAG2GESD-C02P |
eMMC |
SAMSUNG/三星 |
16GB |
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1.8V/3.3V |
-40°C~85°C |
FBGA-100 |
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點(diǎn)擊查看 |
KLMCG2UCTA-B041 |
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KLMCG2UCTA-B041 |
eMMC |
SAMSUNG/三星 |
64GB |
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1.8/3.3V |
-25°C~85°C |
BGA |
EOL |
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11.5mm x 13mm x 0.8mm |
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5.1 |
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HS400 |
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點(diǎn)擊查看 |
KLMAG2GEUF-B04Q |
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KLMAG2GEUF-B04Q |
eMMC |
SAMSUNG/三星 |
16Gb |
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1.8/3.3V |
-40℃~105℃ |
BGA |
Mass Production |
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11.5mm x 13mm x 0.8mm |
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5.1 |
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HS400 |
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點(diǎn)擊查看 |
KLMAG2GEUF-B04P |
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KLMAG2GEUF-B04P |
eMMC |
SAMSUNG/三星 |
16Gb |
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1.8/3.3V |
-40℃~85℃ |
BGA |
Mass Production |
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11.5mm x 13mm x 0.8mm |
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5.1 |
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HS400 |
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點(diǎn)擊查看 |
KLMCG4JEUD-B04Q |
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KLMCG4JEUD-B04Q |
eMMC |
SAMSUNG/三星 |
64GB |
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1.8/3.3V |
-40℃~105℃ |
BGA |
Mass Production |
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11.5mm x 13mm x 1.2mm |
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5.1 |
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HS400 |
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點(diǎn)擊查看 |
KLMDG8JEUD-B04P |
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KLMDG8JEUD-B04P |
eMMC |
SAMSUNG/三星 |
128GB |
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1.8/3.3V |
-40℃~85℃ |
FBGA-153 |
Mass Production |
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11.5mm x 13mm x 1.2mm |
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5.1 |
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HS400 |
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點(diǎn)擊查看 |
KLM8G1GEUF-B04Q |
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KLM8G1GEUF-B04Q |
eMMC |
SAMSUNG/三星 |
8GB |
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1.8/3.3V |
-40℃~105℃ |
BGA |
Mass Production |
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11.5mm x 13mm x 0.8mm |
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5.1 |
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HS400 |
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點(diǎn)擊查看 |
KLMBG4GEUF-B04Q |
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KLMBG4GEUF-B04Q |
eMMC |
SAMSUNG/三星 |
32GB |
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1.8/3.3V |
-40℃~105℃ |
BGA |
Mass Production |
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11.5mm x 13mm x 0.8mm |
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5.1 |
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HS400 |
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點(diǎn)擊查看 |
KLMCG4JEUD-B04P |
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KLMCG4JEUD-B04P |
eMMC |
SAMSUNG/三星 |
64GB |
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1.8/3.3V |
-40℃~85℃ |
BGA |
Mass Production |
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11.5mm x 13mm x 1.2mm |
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5.1 |
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HS400 |
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點(diǎn)擊查看 |
KLMDG4UCTB-B041 |
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KLMDG4UCTB-B041 |
eMMC |
SAMSUNG/三星 |
128GB |
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1.8/3.3V |
-25°C~85°C |
BGA |
Mass Production |
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11.5mm x 13mm x 1.0mm |
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5.1 |
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HS400 |
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點(diǎn)擊查看 |
KLMBG2JENB-B041 |
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KLMBG2JENB-B041 |
eMMC |
SAMSUNG/三星 |
32GB |
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1.8/3.3V |
-25°C~85°C |
FBGA-153 |
Archived |
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11.5mm x13mm x1.0mm |
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5.1 |
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HS400 |
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點(diǎn)擊查看 |
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