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THGBMUG7C1LBAIL

THGBMUG7C1LBAIL

eMMC

Toshiba/KIOXIA東芝/鎧俠

16GB

400mb/s

2.7V~3.6V

-25℃~85℃

BGA-153

11.5mm×13.0mm×0.8mm

5.1

15nm

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THGBMUG8C2LBAIL

THGBMUG8C2LBAIL

eMMC

Toshiba/KIOXIA東芝/鎧俠

32GB

400mb/s

2.7V~3.6V

-25℃~85℃

BGA-153

11.5mm×13.0mm×0.8mm

5.1

15nm

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THGBMVG7T13BAIL

THGBMVG7T13BAIL

eMMC

Toshiba/KIOXIA東芝/鎧俠

BGA

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THGBMVG8T13BAIL

THGBMVG8T13BAIL

eMMC

Toshiba/KIOXIA東芝/鎧俠

BGA

Click view

THGBMHG6C1LBAIL

THGBMHG6C1LBAIL

eMMC

Toshiba/KIOXIA東芝/鎧俠

8GB

2.7V~3.6V

-25℃~85℃

BGA-153

11.5mm×13.0mm×0.8mm

15nm

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H26M41204HPR

H26M41204HPR

eMMC

SK HYNIX/海力士

8GB

FBGA-153

11.5mm×13mm×0.8mm

5.1

Click view

H26M41208HPR

H26M41208HPR

eMMC

SK HYNIX/海力士

8GB

FBGA

Mass production

11.5mm×13mm×0.8mm

5.1

64Gb

EE510

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H26M51002KPR

H26M51002KPR

eMMC

SK HYNIX/海力士

16GB

FBGA-96

Mass production

11.5mm×13mm×0.8mm

5.1

128Gb

EG510

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H26M52208FPRN

H26M52208FPRN

eMMC

SK HYNIX/海力士

16GB

3.3V/1.8V

-25℃~85℃

BGA-153

Mass production

5.1

EE510A

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H26M62002JPR

H26M62002JPR

eMMC

SK HYNIX/海力士

32GB

FBGA-153

Mass production

11.5mm×13mm×0.8mm

5.1

128Gb

EG510

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H26M41208HPRN

H26M41208HPRN

eMMC

SK HYNIX/海力士

8Gb

3.3V/1.8V

-25℃~85℃

FBGA-153

Mass Production

5.1

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KLMBG2JETD-B041

KLMBG2JETD-B041

eMMC

SAMSUNG/三星

32GB

1.8/3.3V

-25°C~85°C

BGA-153

Mass Production

11.5mm x 13mm x 0.8mm

5.1

HS400

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KLM8G1GETF-B041

KLM8G1GETF-B041

eMMC

SAMSUNG/三星

8GB

1.8~3.3V

-25°C~85°C

FBGA-153

Mass Production

1120/TRAY

5.1

HS400

Click view

KLMAG1JETD-B041

KLMAG1JETD-B041

eMMC

SAMSUNG/三星

16GB

1.8~3.3V

-25°C~85°C

FBGA-153

Mass Production

1120/TRAY

11.5mm*13mm*0.8mm

5.1

HS400

Click view

KLM4G1FETE-B041

KLM4G1FETE-B041

eMMC

SAMSUNG/三星

4GB

1.8~3.3V

-25°C~85°C

FBGA-153

Mass Production

11mm x 10mm x 0.8mm

5.1

HS400

Click view

KLM8G1GEAC-B001

KLM8G1GEAC-B001

eMMC

SAMSUNG/三星

8GB

2.7V~3.6V

-25°C~85°C

FBGA-153

11.5mm x 13mm x 1.0mm

4.5

HS200

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KLM8G1GEME-B041

KLM8G1GEME-B041

eMMC

SAMSUNG/三星

8GB

1.8/3.3V

-25°C~85°C

FBGA-153

Archived

11.5mm x 13mm x 0.8mm

5.1

HS400

Click view

KLM8G1GESD-B03P

KLM8G1GESD-B03P

eMMC

SAMSUNG/三星

8GB

1.8/3.3V

-40℃~85℃

FBGA-153

Mass Production

11.5mm x 13mm x 0.8mm

5.0

HS400

Click view

KLM8G1GESD-B03Q

KLM8G1GESD-B03Q

eMMC

SAMSUNG/三星

8GB

1.8/3.3V

-40℃~105℃

FBGA-153

Mass Production

11.5mm x 13mm x 0.8mm

5.0

HS400

Click view

KLM8G1GESD-B04P

KLM8G1GESD-B04P

eMMC

SAMSUNG/三星

8GB

1.8/3.3V

-40℃~85℃

BGA-153

Mass Production

11.5mm x 13mm x 0.8mm

5.1

HS400

Click view